Case study — Semiconductor equipment

Wafer-tool frames built to print, 40 tools a year

A tool builder outsourced complete frame sets, machined and pre-assembled, to free its own floor.

The challenge

In-house machining capped tool output at 28/year; frames blocked the assembly floor for weeks before a tool could start build.

What we changed

Frame sets delivered pre-assembled with machined-on interfaces: 5-axis milling of datum features after stress relief, with dimensional reports linked to each tool serial number.

Results

Tool output
28 → 41 / yr demo data
Frame staging time
3 wk → 4 d demo data
On-time frame delivery
97% demo data

We went from 28 tools a year to 41. Frame staging dropped from three weeks to four days, and the floor is finally clear for build.

Hiro Tanaka, Tooling Manager, Bayline Semicon Systems

Send your print, get a quotable answer

Drawings, step files or a sketch: the RFQ form walks through material, tolerance and quantity, and answers with a lead-time and price estimate.

Request a quote